IXPE Black Conductive Sponge Conductive Foam

Product Details
Customization: Available
Industrial Use: Packaging
Transparency: Opaque
Still deciding? Get samples of US$ 0.1/Piece
Request Sample
Gold Member Since 2021

Suppliers with verified business licenses

Audited Supplier

Audited by an independent third-party inspection agency

Number of Employees
9
Year of Establishment
2005-09-09
  • IXPE Black Conductive Sponge Conductive Foam
  • IXPE Black Conductive Sponge Conductive Foam
  • IXPE Black Conductive Sponge Conductive Foam
  • IXPE Black Conductive Sponge Conductive Foam
  • IXPE Black Conductive Sponge Conductive Foam
  • IXPE Black Conductive Sponge Conductive Foam
Find Similar Products
  • Overview
  • Product Description
  • Application
Overview

Basic Info.

Model NO.
JH3070
Hardness
Soft
Basic Level
IXPE
Heat Seal
IXPE
Functional Layer
IXPE
Packaging
PE
Bag Sealing Methods
Customized
Transport Package
Carton
Specification
customized
Trademark
HAOUGER
Origin
China
HS Code
3920109090
Production Capacity
1000000PCS/Month

Product Description

Product Description

IXPE Black Conductive Sponge Conductive FoamIXPE Black Conductive Sponge Conductive Foam

     The product is a closed-cell soft sponge, which is formed by adding conductive fillers into the sponge through radiation crosslinking and foaming. After sheet molding, conductive fillers form conductive paths/networks inside the sheet, so as to achieve the purpose of electrostatic leakage

     High, medium and low density products: The surface resistivity is 104~106Ω and the volume resistivity is 104~106Ω/cm;
Clean, dust-free and detritus-free: The consolidation ability of the conductive fillers was greatly improved after the crosslinking of the molecular chains.
     Corrosion-free and corrosion-resistant: No peculiar smell, and resistant to organic solvents and chemical reagents;
     Weatherproof and moisture-proof, anti-seismic and heat-insulating: Closed-hole bubbles are fine and even, with good hygroscopic performance, cushioning and anti-seismic, heat and sound insulation;
     Machining performance is good, can be punched into various shapes required by customers.
 
Application


    The products are mainly used for anti-static packaging of anti-static plugging board, buffer pad, semiconductor chip, printed circuit board, integrated circuit, precision high-frequency electronic products, storage and transportation packaging of industrial modules, high-frequency components, aeronautical instruments, weapons and ammunition.
 

Send your message to this supplier

*From:
*To:
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now
Contact Supplier